Infrastructure
300mm cleanroom
300mm cleanroom
A key enabler for our advanced scaling R&D remains materials research. Therefore, we continue extending our capabilities with advanced deposition tools (metal PVD, metal CVD, III-V MoCVD, direct plating) as well as upgrading several dry etch chambers.
Facts:
- Ballroom type of cleanroom
- 4,800m² class 1,000 area
- Silicon pilot line for (sub-)32nm
- CMOS processing on 300mm wafers, 450mm-ready
- Semi-industrial operation – 24/24 and 7/7, process monitoring, short cycle time
- Unique lithography cluster centered around ASML equipment
- Advanced equipment and preproduction tools