MIDLAND, Mich. – JulyXX, 1999 – IMEC, Europe’s leading microelectronics research center in Leuven, Belgium, has publicly announced the successful integration of copper interconnects in a dual damascene architecture with SiLK* semiconductor dielectric resin from The Dow Chemical Company, Midland, Mich., USA.  The announcement was made at the International Interconnect Technology Conference (IITC) held in San Francisco, Calif., May 24-26.

Specifically, the dual damascene technology employs the embedded hardmask approach using silicon dioxide as the etch stop.  Using the copper interconnect with physical vapor deposition (PVD) seeding and electrochemical deposition (ECD) fill technology, the system was integrated into N-channel metal oxide semiconductor (NMOS) devices.  No device or electrical parameter degradation occurred, indicating the compatibility of the copper with the SiLK resin.

“The successful integration of SiLK resin in a dual damascene structure provides our partners the latest in process innovation with leading edge materials,” said Dr. Luc Van den hove, vice president, Silicon Process Technology IMEC.  

Introduced by Dow in 1996, SiLK resins were specifically developed for use as an interlayer dielectric (ILD) material for high-performance integrated circuits.  The spin-on aromatic polymer has no fluorine in its composition, delivers superior planarization and gapfill, and has a processing stability of up to 490o C (914 o F).  Further, the resin features a low isotropic dielectric constant of 2.64 which is 40 percent lower than that of silicon dioxide, the traditional ILD material. As a result, SiLK enhances the performance of semiconductor devices resulting in faster processing speeds and reduced “cross talk.”  These properties make this material suitable for all existing CMOS interconnect technologies using copper/damascene or Al/W technologies.

“As the semiconductor industry looks at new technologies, Dow is committed to delivering advanced materials that support current processes and provide improved performance to meet future demands,” said Joe Carr, business director, Advanced Electronic Materials, Dow Chemical.  “The results achieved in IMEC’s evaluation reinforce our belief that SiLK resin will continue to be at the forefront of industry developments.”

The current work at IMEC is being conducted as part of the organization’s Low k Affiliation Program, and the results are immediately available to the international partners involved in this research program.  In the future, IMEC will make the SiLK resin test data and integration process details available to other interested companies.

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Notes to editors

ABOUT IMEC

IMEC was founded in 1984 and today is Europe’s leading independent research center for the development and licensing of state-of-the-art microelectronic technologies.  IMEC is headquartered in Leuven, Belgium, and employs about 850 people, of whom 75 percent are highly qualified scientists and engineers.  Its $88 million revenue is derived from agreements and contracts with government agencies, aerospace and semiconductor industry companies worldwide.  IMEC’s activities concentrate on: design of integrated information and communication systems; silicon process technology; silicon technology and device integration;, microsystems, components and packaging; advanced training in microelectronics.

Dow’s Advanced Electronic Materials business provides a variety of materials and technologies to support customer innovation in the electronics market.  Dow’s portfolio of low k dielectric materials for semiconductor packaging, fabrication and interconnect applications includes SiLK resins and CYCLOTENE* dielectric materials.  Polymeric light emitting diodes (PLEDs) from Dow will help computer manufacturers reduce the weight and thickness of electronic devices, such as laptop computers, by replacing traditional light sources. Through its majority stake in the Intarsia Corporation, San Jose, Calif., Dow is also involved in the manufacture of thin-film integrated components for passive component and interconnect technologies used in electronic and wireless systems.

The Dow Chemical Company is a global science and technology-based company that develops and manufactures a portfolio of chemicals, plastics and agricultural products and services for customers in 169 countries around the world.  With annual sales of more than $18 billion, Dow conducts its operations through 14 global businesses employing 39,000 people.

For more information about SiLK resin and CYCLOTENE dielectric materials from Dow, please contact the Customer Information Group at 1-800-441-4369.

For more information about Dow Kellie Nolan, Gibbs & Soell, Inc., (847) 519-9150,                  knolan@gibbs-soell.com

For additional information about IMEC, contact

Marianne Van den Broeck,

Head of Public Relations at IMEC,

+32 16 28 14 91,

Marianne.vandenbroeck@imec.be

or visit the organization’s web site at http://www.imec.be/

*Trademark of The Dow Chemical Company