A breakthrough technology for the manufacture of high-k dielectrics for sub 100 nm devices and deposition of barrier and seed layers for application in dual damascene technology

Leuven, Belgium,  26 October 1999…. IMEC and ASM International have signed an agreement for collaboration on Atomic Layer CVD technology development for applications into advanced silicon device manufacturing.

Recent IMEC research indicates that below 2.5 nm effective oxide thickness, the reliability of conventional thin oxide dielectrics is worse than previously understood and constitutes a serious barrier to scaling devices down to less than 100nm geometries. IMEC, in collaboration with ASMI as its strategic partner, is therefore launching a new wide-ranging, industrial affiliation programme focused on high k dielectrics.   “We invite all companies with an interest and expertise in this field to participate in this initiative,” said Luc Van den hove, IMEC vice-president Silicon Process Technology.

The success of this programme is critical, in view of the continuously accelerating SIA roadmap. To meet this timescale, progress in such a critical layer in an IC is possible only through  large-scale international collaboration.  ”By closely working with IMEC and several semiconductor manufacturers in one programme, there is an excellent chance that the right technology will be developed in time for 100 nm generation device manufacturing,” said Ivo Raaijmakers, Chief Technology Officer of ASM International. 

In terms of direction, we know that the Atomic Layer CVD technique offers some unique advantages over competitive approaches.  Atomic Layer CVD is, as it suggests, atomic layer by layer deposition, resulting in perfect thickness and uniformity as well as composition control over large substrates.   We therefore aim to use this technique to deposit very thin high k dielectric layers, such as (but not limited to) Al2O3, ZrO2, HfO2, and their silicates for use as alternative gate dielectrics.”

“This layered deposition technique also results in perfect deposition conformality of metallic layers used as barrier and seed layers for Cu interconnects in a dual damascene scheme. This work on Cu interconnects is running concurrently in an industrial affiliation program launched by IMEC last year,“ Luc Van den hove noted.  

ASMI is already a participant in this programme with low-k dielectric deposition in its Eagle 10 PECVD tool.  “Complementing our low-k dielectric development with these perfectly conformal barrier and seed layers in a dual damascene approach will enable our customers to manufacture advanced interconnects at the lowest possible cost,” says Ivo Raaijmakers.

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Notes to editors

ABOUT IMEC

IMEC was founded in 1984 and today is Europe's leading independent research centre for the development and licensing of state-of-the-art microelectronic technologies.  IMEC is headquartered in Leuven, Belgium, and employs about 850 people, of whom 75 percent are highly qualified scientists and engineers.  Its $88 million revenue is derived from agreements and contracts with government agencies, aerospace and semiconductor industry companies worldwide.  IMEC's activities concentrate on: design of integrated information and communication systems; silicon process technology; silicon technology and device integration; microsystems, components and packaging; advanced training in microelectronics.

ABOUT ASM INTERNATIONAL

ASM International is headquartered in Bilthoven, the Netherlands. Its Subsidiaries design, manufacture and market equipment and materials used to produce semiconductor devices.  ASM International and its

subsidiaries provide production solutions for the wafer processing, assembly and packaging segments through their facilities in the United States, Europe, Japan and Asia.  ASM International’s common

shares trade on NASDAQ and on the AEX Stock Exchange under the symbol “ASMI.” Additional information on ASM can be found on its web site at http://www.asm.com

For further information please contact:

Marianne Van den Broeck

Public Relations and Marketing Communications Manager

IMEC, Kapeldreef 75

B- 3001 Leuven, Belgium

http://www.imec.be

Tel +32 16 28 14 91 Fax +32 16 28 16 37

Email: Marianne..vandenbroeck@imec.be