Imec News
Archive 2006
- 11/12/2006 - IMEC demonstrates feasibility of 3D-stacked IC integration
- 11/12/2006 - IMEC explores copper contact technology for (sub-)32nm CMOS
- 11/12/2006 - IMEC realized germanium pMOS devices with record performance
- 06/12/2006 - ASM INTERNATIONAL AND IMEC DEMONSTRATE THREE GENERATIONS OF AURORA® LOW-K MATERIALS
- 06/11/2006 - IMEC strengthens its position on Indian semiconductor market
- 19/10/2006 - IMEC demonstrates multimedia decoding on reconfigurable processor with record power efficiency
- 18/10/2006 - IMEC’s flexible air interface for future wireless terminals ready for transfer
- 18/10/2006 - IMEC demonstrates feasibility of double patterning immersion litho for 32nm node
- 18/10/2006 - IMEC maximizes its potential towards More than Moore
- 18/10/2006 - IMEC and NSC successfully developed Copper-Top interconnect technology and transferred it to NSC facility
- 11/10/2006 - IMECs Europractice provides TSMC technologies to European companies and academia
- 27/09/2006 - IMECs (sub-)32nm research platform shows momentum in record IEDM papers
- 29/08/2006 - IMEC received first EUV tool in the world on August 16
- 27/07/2006 - ICOS VISION SYSTEMS and IMEC collaborate on 3D packaging metrology
- 26/07/2006 - IMEC software-defined radio concept compliant with 3GPP-LTE
- 11/07/2006 - IMEC shifts lithography program towards hyper-NA immersion, double-patterning immersion and EUV
- 11/07/2006 - SEMICON WEST 2006, BOOTH 641, SOUTH HALL, MOSCONE CENTER, SAN FRANCISCO
- 15/06/2006 - IMEC shows potential of FUSI for low-power applications and its extendibility to high performance - Device performance meets ITRS for 45nm
- 29/05/2006 - IMEC demonstrates growth of GaN high-electron mobility transistors on 150 mm silicon
- 17/05/2006 - IMEC and RIBER collaborate on Ge and III-V devices for the sub-22nm node
- 11/05/2006 - IMEC and INT report first MPEG-4 3D graphics player for mobile phones
- 26/04/2006 - IMEC annual accounts confirm steady growth
- 04/04/2006 - IMEC boosts Ge cells for thermophotovoltaic applications
- 04/04/2006 - IMEC and University of Ghent present new concept for bendable packaged ultra-thin chips
- 22/03/2006 - Belgian investment fund wants to become Europe's finest
- 06/03/2006 - IMEC, Arteris, CoWare, Mentor Graphics zeroes in on multi-mode multi-media ambient-intelligence platforms
- 15/02/2006 - Belgian spin-off secures €6 million in Malaysian funding
- 11/02/2006 - IMEC demonstrates viability of laser anneal for the 32nm node
- 06/02/2006 - IMEC’s ISSCC presentations report major breakthroughs in ultra-wideband receivers, data acquisition systems, and record low-power ADC
- 26/01/2006 - Europe takes leading role in developing chip design tools for next-generation wireless applications
- 24/01/2006 - Applied Materials and IMEC team to develop innovative 32nm, 22nm interconnects