ICOS Vision Systems Corporation NV (Nasdaq and Euronext: IVIS), a leading supplier of inspection solutions for the semiconductor industry and IMEC, a world-leading independent research center in nanoelectronics and nanotechnology, have agreed to work together under a two-year Joint Exploration and Development Program (JEDP), in the field of inspection and metrology for three dimensional (3D) packaging. According to market analysts, the market for 3D packaging will grow rapidly over the next years, driven by the quest for smaller and higher performance Integrated Circuits (IC's).

Research will be performed at the IMEC laboratories and ICOS will provide technology and equipment for inspection and metrology. The joint research program will concentrate on the development and optimization of several 3D packaging processes for IC's, including Wafer Level Packaging (WLP), flip chip, systems-in-a-package (SiP) and micro-electromechanical systems (MEMS) and on the optimization of the 3D metrology methods for these applications.  The program will be closely connected to IMEC's industrial affiliation program (IIAP) on 3D stacked IC's. The IIAP program brings together the researchers of IMEC and of world-leading suppliers of IC's, to jointly develop the technologies of future generation products.

"We are impressed with IMEC’s research programs on semiconductor packaging and are delighted to join their international consortium," said Gust Smeyers, ICOS' Senior Vice President for Research and Development. "We look forward to working together with IMEC and the largest IC manufacturers around the world on the development of advanced 3D packaging processes. This program underscores our technical leadership in our field and our unrelenting commitment to invest in the technologies and products of the future."

"Packaging is becoming an increasingly important part of semiconductor manufacturing and we are expanding our research efforts in the packaging field, including a large research program on 3D packaging," said Gilbert Declerck, CEO of IMEC. "We are delighted to work with ICOS on the advancements of the 3D packaging processes and the metrology tools that are needed."

For more information:

ICOS Vision Systems Corporation NV</b>
Jody Burfening
Tel: 32 16 398 220
Email: Investor.relations@icos.be
Lippert/Heilshorn & Associates, Inc.
212-838-3777

IMEC
Katrien Marent
Corporate Communication Manager
IMEC, Kapeldreef 75
B- 3001 Leuven, Belgium
Tel +32 16 28 18 80 Fax +32 16 28 16 37
Email: Katrien.Marent@imec.be

'Safe Harbor' Statement under the Private Securities Litigation Reform Act of 1995: Certain matters discussed in this press release, such as the expected growth of the market for 3D packaging, the intended results of the Joint Exploration and Development Program and ICOS’ product development plans and expectations regarding that collaboration, are forward-looking statements. These statements are subject to known and unknown risks and uncertainties that could cause actual results to differ materially from those projected or anticipated. Joint exploration and development programs involve numerous risks, including difficulties associated with cooperation and conflicts of interest among the parties.  In addition, the technologies and products developed through the collaboration, as well as the anticipated market growth for 3D packaging, will be subject to the significant risks and uncertainties generally applicable to ICOS including: risks related to the evolution of the semiconductor and semiconductor equipment markets, including the cyclical nature of those markets and the uncertainty of market growth; the uncertainty of new product development, including the risk that newly introduced products may contain undetected errors or defects or otherwise not perform as anticipated; budget overruns; project delays; rapid technological change; competition; risks relating to intellectual property protection and ownership and associated litigation; as well as other risks set forth in ICOS’s most recent annual report on form 20-F and other filings with the Securities and Exchange Commission.  ICOS cautions readers not to place undue reliance upon any such forward-looking statements, which speak only as of the date made.  ICOS expressly disclaims any obligation or undertaking to release publicly any updates or revisions to any such statements to reflect any change in ICOS’ expectations or any change in events, conditions or circumstances on which any such statement is based.