Scaling-driven nanoelectronics

3D integration: design and architecture of 3D ICs

• 3D systems-in-a-package
• 3D wafer-level packaging
• 3D stacked IC and 3D IC
• 3D design
• Packaging reliability

Imec studies packaging issues and offers technological solutions for reliable innovative packaging.

Invent - This research covers a broad range of topics, such as the reliability of 3D SIC and 3D WLP, lead-free solders, and flexible and stretchable electronics. It also studies cooling- and material-related reliability, and failure analysis. Most reliability experiments are supported by thermal and mechanical finite-element modeling (FEM). Imec's research on lead-free solders focuses mainly on lead-free solder bumps used in flip-chip technology and wafer-level chip-sized packaging. Imec develops dedicated equipment for analyzing lead-free alternatives at extreme conditions, such as measuring creep at high temperatures or brittleness at low temperatures.