Scaling-driven nanoelectronics

Interconnections (back-end)

If the transistors are further miniaturized, also the connections between the transistors and the circuits have to follow suit. There is a need for more, finer, denser interconnects. IMEC aspires to find interconnection solutions for the (sub-)22nm nodes by studying Cu and low-k solutions. Further down the road, 3D interconnections will allow for still denser packing of functions.